3100 Series

Automated Wet Chemical Processing Systems
Model 3100

COMMON FEATURES

  • Simplicity = Reliability
  • Effective Chemical Drain Diversion
  • Up to 6 nozzles for Chemistry + Top Side Rinse
  • Automatic Chamber Rinsing using 10 nozzles
  • Uniform Process Airflow
  • Recessed Spray Nozzles, optional Drain Diversion
  • Optional Automated Substrate Handling
  • Interconnect capability between modules
SAFETY FEATURES

  • Notification When Beneficial; Hard Shutdown Only When Necessary
  • Extensive Safety Interlocking Through both Hardware and Software
  • Double Containment for Chemistry
  • Total Isolation of Chemicals and Electronics
  • Anti-Splashback Design
    Protection for Operators
FLEXIBILITY

  • Systems Dedicated to a Single Process, or Combination Systems Performing Multiple Processes
  • A Wide Variety of Options to Customize the System for Your Application(s)
    – Binary, Fan, Stream and/or High Pressure Jet Nozzles
    – Variety of Canisters, Pumps, Exhausts, Drains, Brushes, etc; with or without Chemical Temperature Control
SIMPLICITY/RELIABILITY/ SERVICEABILITY

  • Elegantly Simple Design
  • Standard Parts Used Throughout
  • Field-Proven Reliability
  • Easy Access to All Areas forMaintenance/Service
  • Password Protected Screens
  • Protection Against Operator Error
Model 3145
Easy-to-read, menu-driven software

MODEL 3110 CLEANER

Applications:

– Organic Clean

  • H2SO4 and H202
  • Acid Clean
  • Hot DI H20 Rinse
  • Neutralizer Topside and Backside

– Particulate Clean

  • High Pressure Jet
  • DI H20 Rinse

– Final Clean

  • Surfactant Spray
  • Bi-Directional Brush
  • DI H20 Rinse

– Spin Dry

– Automatic Chamber Rinse before next substrate processed

MODEL 3140 DEVELOP, ETCH or STRIP SYSTEM

Applications:

– Spray Develop for Laser Exposed Positive Resist

– Spray Etch of chrome

– Resist Strip

  • Chemical Dispencse Using Fan or Binary Nozzle(s)
  • DI H2O Rinse Using One or Two Fan Sprays
  • Spin Dry

– Automatic Chamber Rinse before next substrate processed

MODEL 3140 DEVELOP and ETCH SYSTEM

Develop/Etch Process:
  • Spray Develop Using Fan or Binary Nozzle(s)
  • DI H2O Rinse Using One or Two Fan Sprays
  • Rinse Develop Nozzle(s) and Chamber Rinse
  • Spray Etch Using Fan or Binary Nozzle(s)
  • DI H2O Rinse Using One or Two Fan Sprays
  • Spin Dry

– Automatic Chamber Rinse before next substrate processed