1100 Series

Automated Wet Chemical Processing Systems

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COMMON FEATURES

  • Simplicity = Reliability
  • Small System Footprint (30.5″W x 43″D x 60.5″H) (775 mm x1092 mm x 1537 mm)
  • Effective Chemical Drain Diversion
  • Large (24″, 609 mm) Diameter Process Chamber
  • Up to 6 nozzles for Chemistry + Top Side Rinse
  • Up to 8 nozzles for Thorough Chamber Rinse
  • Uniform Process Airflow
  • Recessed Spray Nozzles, optional Drain Diversion
SAFETY FEATURES

  • Notification When Beneficial; Hard Shutdown Only When Necessary
  • Extensive Safety Interlocking Through both Hardware and Software
  • Double Containment for Chemistry
  • Total Isolation of Chemicals and Electronics
  • Transparent, Interlocked Chamber Door
  • Anti-Splashback Design
    Protection for Operators
FLEXIBILITY

  • Systems Dedicated to a Single Process, or Combination Systems Performing Multiple Processes
  • A Wide Variety of Options to Customize the System for Your Application(s)
    – Binary, Fan, Stream and/or High Pressure Jet Nozzles
    – Variety of Canisters, Pumps, Exhausts, Drains, Brushes, etc; with or without Chemical Temperature Control
SIMPLICITY/RELIABILITY/ SERVICEABILITY

  • Elegantly Simple Design
  • Standard Parts Used Throughout
  • Field-Proven Reliability
  • Easy Access to All Areas forMaintenance/Service
  • Password Protected Screens
  • Protection Against Operator Error
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Compact chemical storage within small footprint
Easy-to-read, menu-driven software

MODEL 1110 CLEANER

Applications:

– Organic Clean

  • H2SO4 and H202
  • Acid Clean
  • Hot DI H20 Rinse
  • Neutralizer Topside and Backside

– Particulate Clean

  • High Pressure Jet
  • DI H20 Rinse

– Final Clean

  • Surfactant Spray
  • Bi-Directional Brush
  • DI H20 Rinse

– Spin Dry

MODEL 1140 DEVELOP/ETCH SYSTEM

Applications:

– Spray Develop for Laser Exposed Positive Resist

  • Spray Develop Using Fan or Binary Nozzle(s)
  • DI H2O Rinse Using One or Two Fan Sprays
  • Spin Dry

– Spray Etch

  • Spray Etch Using Fan or Binary Nozzle(s)
  • DI H2O Rinse Using One or Two Fan Sprays
  • Spin Dry

MODEL 1140 DEVELOP/ETCH SYSTEM

Develop/Etch Process:
  • Spray Develop Using Fan or Binary Nozzle(s)
  • DI H2O Rinse Using One or Two Fan Sprays
  • Rinse Develop Nozzle(s) and Chamber Rinse
  • Spray Etch Using Fan or Binary Nozzle(s)
  • DI H2O Rinse Using One or Two Fan Sprays
  • Spin Dry